Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7662665 | Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging | Chen-Shien Chen, Kuo-Chin Chang, Szu-Wei Lu, Pei-Haw Tsao, Han-Liang Tseng +1 more | 2010-02-16 |
| 7446398 | Bump pattern design for flip chip semiconductor package | Pao-Kang Niu, Pei-Haw Tsao, Hao-Yi Tsai, Yung Kuan Hsiao, Shang-Yun Hou +1 more | 2008-11-04 |
| 7443010 | Matrix form semiconductor package substrate having an electrode of serpentine shape | Pei-Haw Tsao, Chender Huang | 2008-10-28 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads | Szu-Wei Lu, Hsin-Hui Lee, Mirng-Ji Lii | 2008-04-22 |
| 7112522 | Method to increase bump height and achieve robust bump structure | Pei-Haw Tsao, Clinton Chao | 2006-09-26 |
| 6787926 | Wire stitch bond on an integrated circuit bond pad and method of making the same | Chih-Chiang Chen, Pei-Haw Tsao | 2004-09-07 |
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2004-08-03 |
| 6596619 | Method for fabricating an under bump metallization structure | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2003-07-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2003-03-04 |