Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095600 | Display screen or portion thereof with transitional graphical user interface | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +4 more | 2025-09-30 |
| D1080682 | Display screen or portion thereof with transitional graphical user interface | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +4 more | 2025-06-24 |
| D1073693 | Display screen or portion thereof with icon | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +3 more | 2025-05-06 |
| D1072867 | Display screen or portion thereof with icon | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +3 more | 2025-04-29 |
| D1072870 | Display screen or portion thereof with icon | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +3 more | 2025-04-29 |
| D1072868 | Display screen or portion thereof with icon | Alex Anthony Tursi, Elbert Tiao, Jane Yoon, Byeong Chae Cho, John Schlemmer +3 more | 2025-04-29 |
| 11810259 | System and method for generating asynchronous augmented reality instructions | Karthik Ramani, Subramaniam Chidambaram, Fengming He | 2023-11-07 |
| 11380069 | System and method for generating asynchronous augmented reality instructions | Karthik Ramani, Subramaniam Chidambaram, Fengming He | 2022-07-05 |
| 7390697 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Pei-Haw Tsao, Jones Wang | 2008-06-24 |
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2005-11-01 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Pei-Haw Tsao, Jones Wang | 2005-04-26 |
| 6782897 | Method of protecting a passivation layer during solder bump formation | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-31 |
| 6774026 | Structure and method for low-stress concentration solder bumps | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-10 |
| 6770958 | Under bump metallization structure | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2004-08-03 |
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2003-10-28 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2003-07-22 |