Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754849 | Organic-inorganic hybrid structure for integrated circuit packages | Plory Huang, Henry Su, Chee-Key Chung, Ryan Jason Ong, Daniel Hsieh | 2017-09-05 |
| 7390697 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Pei-Haw Tsao, Hank Huang | 2008-06-24 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen | 2006-03-21 |
| 6960518 | Buildup substrate pad pre-solder bump manufacturing | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen, Hank Huang | 2005-11-01 |
| 6939789 | Method of wafer level chip scale packaging | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2005-09-06 |
| 6884662 | Enhanced adhesion strength between mold resin and polyimide | Ken-Ching Chen, Chender Huang, Pei-Haw Tsao, Hank Huang | 2005-04-26 |
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-10-28 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package | Pei-Haw Tsao, Ken-Ching Chen | 2003-08-19 |