Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8217520 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Bill Kiang, Liang-Chen Lin, I-Tai Liu | 2012-07-10 |
| 7843058 | Flip chip packages with spacers separating heat sinks and substrates | Pei-Haw Tsao, Liang-Chen Lin | 2010-11-30 |
| 7719122 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Bill Kiang, Liang-Chen Lin, I-Tai Liu | 2010-05-18 |
| 7679180 | Bond pad design to minimize dielectric cracking | Pei-Haw Tsao, Liang-Chen Lin, I-Tai Liu, Bill Kiang | 2010-03-16 |
| 7659632 | Solder bump structure and method of manufacturing same | Pei-Haw Tsao, Bill Kiang, Liang-Chen Lin, I-Tai Liu | 2010-02-09 |
| 7602065 | Seal ring in semiconductor device | Shang-Yun Hou, Chun-Hung Chen, Chia-Lun Tsai, Shin-Puu Jeng | 2009-10-13 |
| 7446398 | Bump pattern design for flip chip semiconductor package | Pei-Haw Tsao, Hao-Yi Tsai, Yung Kuan Hsiao, Chung Yu Wang, Shang-Yun Hou +1 more | 2008-11-04 |
| 7148574 | Bonding pad structure and method of forming the same | Jian-Hsing Lee, Ko-Yi Lee | 2006-12-12 |
| 6630051 | Auto slurry deliver fine-tune systems for chemical-mechanical-polishing process and method of using the system | — | 2003-10-07 |
| 6410441 | Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system | — | 2002-06-25 |
| 6277751 | Method of planarization | Chang-Sheng Lee, Bih-Tiao Lin, Sen-Nan Lee | 2001-08-21 |