Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7685667 | Post-CMP cleaning system | Jin Lung Linh | 2010-03-30 |
| 6821895 | Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP | Soon-Kang Huang | 2004-11-23 |
| 6660629 | Chemical mechanical polishing method for fabricating copper damascene structure | — | 2003-12-09 |
| 6604849 | Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration | Meng-Feng Tsai, Rong Jye Jang, Kung-Teng Huang | 2003-08-12 |
| 6524950 | Method of fabricating copper damascene | — | 2003-02-25 |
| 6454917 | High throughput and high performance copper electroplating tool | — | 2002-09-24 |
| 6343977 | Multi-zone conditioner for chemical mechanical polishing system | SHUANG PENG | 2002-02-05 |
| 6277751 | Method of planarization | Pao-Kang Niu, Chang-Sheng Lee, Sen-Nan Lee | 2001-08-21 |
| 6218307 | Method of fabricating shallow trench isolation structure | — | 2001-04-17 |
| 6180489 | Formation of finely controlled shallow trench isolation for ULSI process | Fu-Liang Yang, Wei-Ray Lin, Erik S. Jeng | 2001-01-30 |
| 6140240 | Method for eliminating CMP induced microscratches | Fu-Liang Yang, Tzu-Shih Yen, Bi-Ling Chen, Erik S. Jeng | 2000-10-31 |
| 6089969 | Powder-proof apparatus for a PECVD reactor chamber | Min-Yuan Chung, Wen Chang Tseng | 2000-07-18 |
| 6071789 | Method for simultaneously fabricating a DRAM capacitor and metal interconnections | Fu-Liang Yang, Erik S. Jeng, I-Ping Lee | 2000-06-06 |
| 6054017 | Chemical mechanical polishing pad with controlled polish rate | Fu-Liang Yang | 2000-04-25 |
| 6037259 | Method for forming identifying characters on a silicon wafer | Fu-Liang Yang | 2000-03-14 |
| 5888124 | Apparatus for polishing and cleaning a wafer | Fu-Liang Yang | 1999-03-30 |