Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209278 | Replacement source/drain finFET fabrication | Daniel Tang | 2015-12-08 |
| 9159810 | Doping a non-planar semiconductor device | Daniel Tang | 2015-10-13 |
| 9006065 | Plasma doping a non-planar semiconductor device | Daniel Tang, Tsungnan Cheng | 2015-04-14 |
| 8871584 | Replacement source/drain finFET fabrication | Daniel Tang | 2014-10-28 |
| 8685825 | Replacement source/drain finFET fabrication | Daniel Tang | 2014-04-01 |
| 7457154 | High density memory array system | Erik S. Jeng | 2008-11-25 |
| 6423646 | Method for removing etch-induced polymer film and damaged silicon layer from a silicon surface | Hsiu-Lan Lee, Pei-Wen Li | 2002-07-23 |
| 6376384 | Multiple etch contact etching method incorporating post contact etch etching | Erik S. Jeng, I-Ping Lee, Eddy Chiang | 2002-04-23 |
| 6306759 | Method for forming self-aligned contact with liner | Erik S. Jeng, Hsiao-Chin Tuan, Chun-Yao Chen, Eddy Chiang, Wen-Shiang Liao | 2001-10-23 |
| 6278189 | High density integrated circuits using tapered and self-aligned contacts | Erik S. Jeng, Fu-Liang Yang | 2001-08-21 |
| 6265296 | Method for forming self-aligned contacts using a hard mask | Erik S. Jeng, Hao Liu, Hung-Yi Luo | 2001-07-24 |
| 6235621 | Method for forming a semiconductor device | Erik S. Jeng, Chi-San Wu, Jong-Bor Wang | 2001-05-22 |
| 6140240 | Method for eliminating CMP induced microscratches | Fu-Liang Yang, Bih-Tiao Lin, Bi-Ling Chen, Erik S. Jeng | 2000-10-31 |
| 6136661 | Method to fabricate capacitor structures with very narrow features using silyated photoresist | Erik S. Jeng | 2000-10-24 |
| 6124192 | Method for fabricating ultra-small interconnections using simplified patterns and sidewall contact plugs | Erik S. Jeng, Hung-Yi Luo | 2000-09-26 |
| 6037216 | Method for simultaneously fabricating capacitor structures, for giga-bit DRAM cells, and peripheral interconnect structures, using a dual damascene process | Hao Liu, Fu-Liang Yang, Wan-Yih Lien | 2000-03-14 |
| 5994228 | Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes | Erik S. Jeng, Fu-Liang Yang | 1999-11-30 |
| 5990018 | Oxide etching process using nitrogen plasma | Yu-Chun Ho, Hung-Yi Luo | 1999-11-23 |
| 5962195 | Method for controlling linewidth by etching bottom anti-reflective coating | Erik S. Jeng | 1999-10-05 |
| 5904154 | Method for removing fluorinated photoresist layers from semiconductor substrates | Rong-Wu Chien, Hsiu-Lan Lee | 1999-05-18 |
| 5899747 | Method for forming a tapered spacer | Kuo-Chang Wu | 1999-05-04 |
| 5895740 | Method of forming contact holes of reduced dimensions by using in-situ formed polymeric sidewall spacers | Rong-Wu Chien | 1999-04-20 |
| 5780338 | Method for manufacturing crown-shaped capacitors for dynamic random access memory integrated circuits | Erik S. Jeng | 1998-07-14 |
| 5688713 | Method of manufacturing a DRAM cell having a double-crown capacitor using polysilicon and nitride spacers | Kung Linliu, Erik S. Jeng | 1997-11-18 |