Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8217520 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Bill Kiang, Liang-Chen Lin, Pao-Kang Niu | 2012-07-10 |
| 7719122 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Bill Kiang, Liang-Chen Lin, Pao-Kang Niu | 2010-05-18 |
| 7679180 | Bond pad design to minimize dielectric cracking | Pei-Haw Tsao, Liang-Chen Lin, Pao-Kang Niu, Bill Kiang | 2010-03-16 |
| 7659632 | Solder bump structure and method of manufacturing same | Pei-Haw Tsao, Bill Kiang, Pao-Kang Niu, Liang-Chen Lin | 2010-02-09 |