Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin | 2015-09-15 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsiun Lee, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin | 2013-07-23 |
| 8217520 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu | 2012-07-10 |
| 7719122 | System-in-package packaging for minimizing bond wire contamination and yield loss | Pei-Haw Tsao, Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu | 2010-05-18 |
| 7679180 | Bond pad design to minimize dielectric cracking | Pei-Haw Tsao, Liang-Chen Lin, Pao-Kang Niu, I-Tai Liu | 2010-03-16 |
| 7659632 | Solder bump structure and method of manufacturing same | Pei-Haw Tsao, Pao-Kang Niu, Liang-Chen Lin, I-Tai Liu | 2010-02-09 |