PL

Ping-Yin Liu

TSMC: 97 patents #274 of 12,232Top 3%
UN Unknown: 4 patents #4,220 of 83,584Top 6%
IBM: 4 patents #21,733 of 70,183Top 35%
BI Bonutti Ip: 2 patents #2 of 6Top 35%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
PC P-Tech Co.: 1 patents #13 of 18Top 75%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
JU Jiangnan University: 1 patents #442 of 1,321Top 35%
HP HP: 1 patents #8,774 of 16,619Top 55%
📍 Longbeilingcun, IL: #1 of 30 inventorsTop 4%
Overall (All Time): #9,062 of 4,157,543Top 1%
125
Patents All Time

Issued Patents All Time

Showing 101–125 of 125 patents

Patent #TitleCo-InventorsDate
8945344 Systems and methods of separating bonded wafers Xin-Hua Huang, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai 2015-02-03
8905293 Self-removal anti-stiction coating for bonding process Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more 2014-12-09
8809123 Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai 2014-08-19
8802538 Methods for hybrid wafer bonding Jen-Cheng Liu, Xiaomeng Chen, Xin-Hua Huang, Hung-Hua Lin, Lan-Lin Chao +1 more 2014-08-12
8790946 Methods of bonding caps for MEMS devices Xin-Hua Huang, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng +1 more 2014-07-29
8735260 Method to prevent metal pad damage in wafer level package Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu +2 more 2014-05-27
8728845 Method and apparatus for selectively removing anti-stiction coating Shih-Wei Lin, Lan-Lin Chao, Jung-Huei Peng, Chia-Shiung Tsai 2014-05-20
8629524 Apparatus for vertically integrated backside illuminated image sensors Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao 2014-01-14
8580594 Method of fabricating a semiconductor device having recessed bonding site Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu +2 more 2013-11-12
8478912 Magnetic connector for data and power transfer Livius Dumitru Chebeleu 2013-07-02
8377798 Method and structure for wafer to wafer bonding in semiconductor packaging Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Shang-Ying Tsai 2013-02-19
7879072 Method for implanting a flowable fastener Peter M. Bonutti, Matthew J. Cremens 2011-02-01
7623010 Electrical switch 2009-11-24
7147652 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2006-12-12
7048755 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2006-05-23
6972049 Method for fabricating a diamond film having low surface roughness Chun-Hao Hsieh, Chin-Hon Fan, Hung-Yin Tsai, Chien-Chang Su 2005-12-06
6932835 Suture securing tool Peter M. Bonutti, Matthew J. Cremens 2005-08-23
6710512 Microelement piezoelectric feedback type picking and releasing device Hung-Yin Tsai, Chih-Yung Cheng 2004-03-23
6569187 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2003-05-27
6475230 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2002-11-05
6468293 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2002-10-22
6231592 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2001-05-15
6159234 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2000-12-12
6010525 Method and apparatus for securing a suture Peter M. Bonutti, Matthew J. Cremens 2000-01-04
5986436 Electric power recovering system 1999-11-16