Issued Patents All Time
Showing 26–50 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742262 | Integrated circuit having a resistor layer partially overlapping endcaps | Yuan-Tai Tseng, Chung-Yen Chou, Ming Chyi Liu | 2023-08-29 |
| 11721752 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Ru-Liang Lee | 2023-08-08 |
| 11658224 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2023-05-23 |
| 11637239 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chin-Chieh Yang, Yu-Wen Liao +1 more | 2023-04-25 |
| 11611005 | Backside illuminated photo-sensitive device with gradated buffer layer | Yu-Hung Cheng, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu | 2023-03-21 |
| 11594413 | Semiconductor structure having sets of III-V compound layers and method of forming | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2023-02-28 |
| 11594593 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chung-Yi Yu, Rei-Lin Chu | 2023-02-28 |
| 11532642 | Multi-function substrate | Eugene Chen, Kuan-Liang Liu, Szu-Yu Wang, Ru-Liang Lee, Chih-Ping Chao +1 more | 2022-12-20 |
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-11-08 |
| 11430956 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Chern-Yow Hsu, Shih-Chang Liu | 2022-08-30 |
| 11417520 | Semiconductor structure having sets of III-V compound layers and method of forming | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2022-08-16 |
| 11404484 | Image sensors with organic photodiodes and methods for forming the same | Chin-Wei Liang, Cheng-Yuan Tsai, Hsing-Lien Lin | 2022-08-02 |
| 11367832 | Method of making magnetoresistive random access memory device | Chern-Yow Hsu, Shih-Chang Liu | 2022-06-21 |
| 11348935 | Memory devices and method of fabricating same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2022-05-31 |
| 11329148 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Ru-Liang Lee | 2022-05-10 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2022-03-22 |
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Xiaomeng Chen | 2022-03-15 |
| 11270978 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2022-03-08 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-03-01 |
| 11258007 | Reversed stack MTJ | Wei-Hang Huang, Fu-Ting Sung, Chern-Yow Hsu, Shih-Chang Liu | 2022-02-22 |
| 11222896 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Chen-Jong Wang, Ming Chyi Liu, Shih-Chang Liu, Xiaomeng Chen | 2022-01-11 |
| 11167982 | Semiconductor arrangement and formation thereof | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2021-11-09 |
| 11158593 | Structures for bonding a group III-V device to a substrate by stacked conductive bumps | Jhih-Bin Chen, Ming Chyi Liu, Eugene Chen | 2021-10-26 |
| 11158789 | Leakage resistant RRAM/MIM structure | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu | 2021-10-26 |
| 11158797 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Chern-Yow Hsu, Shih-Chang Liu | 2021-10-26 |