Issued Patents All Time
Showing 76–100 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748967 | Image sensors with organic photodiodes and methods for forming the same | Chin-Wei Liang, Cheng-Yuan Tsai, Hsing-Lien Lin | 2020-08-18 |
| 10727097 | Mechanisms for cleaning substrate surface for hybrid bonding | Sheng-Chau Chen, Chih-Hui Huang, Yeur-Luen Tu, Cheng-Ta Wu, Xiao-Meng Chen | 2020-07-28 |
| 10683204 | Semiconductor arrangement and formation thereof | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2020-06-16 |
| 10665600 | Memory devices and method of fabricating same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2020-05-26 |
| 10665456 | Semiconductor structure | Shih Pei Chou, Chen-Fa Lu, Jiech-Fun Lu, Yeur-Luen Tu | 2020-05-26 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2020-05-26 |
| 10658474 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2020-05-19 |
| 10643964 | Structures for bonding a group III-V device to a substrate by stacked conductive bumps | Jhih-Bin Chen, Ming Chyi Liu, Eugene Chen | 2020-05-05 |
| 10629811 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2020-04-21 |
| 10614948 | Method for forming inductor structure with magnetic material | Yuan-Tai Tseng, Ming Chyi Liu, Chung-Yen Chou | 2020-04-07 |
| 10553785 | Magnetoresistive random access memory device and method of making same | Chern-Yow Hsu, Shih-Chang Liu | 2020-02-04 |
| 10553474 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2020-02-04 |
| 10529916 | Reversed stack MTJ | Wei-Hang Huang, Fu-Ting Sung, Chern-Yow Hsu, Shih-Chang Liu | 2020-01-07 |
| 10522532 | Through via extending through a group III-V layer | Chung-Yen Chou, Shih-Chang Liu, Yung-Chang Chang | 2019-12-31 |
| 10516107 | Memory cell having resistance variable film and method of making the same | Ching-Pei Hsieh, Chern-Yow Hsu, Fu-Ting Sung, Shih-Chang Liu | 2019-12-24 |
| 10516026 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2019-12-24 |
| 10510763 | Embedded nonvolatile memory and forming method thereof | Chang-Ming Wu, Wei-Cheng Wu, Yuan-Tai Tseng, Shih-Chang Liu, Ru-Liang Lee +1 more | 2019-12-17 |
| 10510723 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2019-12-17 |
| 10509312 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Xin-Hua Huang | 2019-12-17 |
| 10510597 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Ping-Yin Liu | 2019-12-17 |
| 10504756 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Xiaomeng Chen | 2019-12-10 |
| 10504904 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Chen-Jong Wang, Ming Chyi Liu, Shih-Chang Liu, Xiaomeng Chen | 2019-12-10 |
| 10497773 | Method to improve MIM device performance | Yao-Wen Chang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2019-12-03 |
| 10497860 | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method | Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chung-Yi Yu, Xiaomeng Chen | 2019-12-03 |
| 10497560 | Uniformity control for Si dot size in flash memory | Chih-Ming Chen, Tsu-Hui Su, Szu-Yu Wang, Chung-Yi Yu, Ru-Liang Lee | 2019-12-03 |