Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11180365 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Jiou-Kang Lee, Chung-Hsien Lin | 2021-11-23 |
| 11018218 | Narrow gap device with parallel releasing structure | Kuei-Sung Chang | 2021-05-25 |
| 11011601 | Narrow gap device with parallel releasing structure | Kuei-Sung Chang | 2021-05-18 |
| 10497776 | Narrow gap device with parallel releasing structure | Kuei-Sung Chang | 2019-12-03 |
| 10457550 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Jiou-Kang Lee, Chung-Hsien Lin | 2019-10-29 |
| 10160633 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Chung-Hsien Lin | 2018-12-25 |
| 10155655 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Chung-Hsien Lin | 2018-12-18 |
| 10099919 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Jiou-Kang Lee, Chung-Hsien Lin | 2018-10-16 |
| 10071905 | Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same | Chia-Hua Chu, Kuei-Sung Chang | 2018-09-11 |
| 9617147 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Chun-Wen Cheng, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin | 2017-04-11 |
| 9611548 | Wafer rotating apparatus | Yuan-Hao Chang, Ying-Ru Shih, Wen-Ching Hsu | 2017-04-04 |
| 9499396 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Jiou-Kang Lee, Chung-Hsien Lin | 2016-11-22 |
| 9466532 | Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same | Chia-Hua Chu, Kuei-Sung Chang | 2016-10-11 |
| 9452924 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Chung-Hsien Lin | 2016-09-27 |
| 9450109 | MEMS devices and fabrication methods thereof | Chia-Hua Chu, Chun-Wen Cheng, Chung-Hsien Lin | 2016-09-20 |
| 9133017 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Chung-Hsien Lin, Chia-Hua Chu | 2015-09-15 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin, Chun-Wen Cheng | 2015-04-14 |
| 8987059 | MEMS devices and methods of forming same | Kai-Chih Liang, Chia-Hua Chu, Jiou-Kang Lee, Chung-Hsien Lin | 2015-03-24 |
| 8969979 | MEMS devices | Yuan-Chih Hsieh | 2015-03-03 |
| 8828772 | High aspect ratio MEMS devices and methods for forming the same | — | 2014-09-09 |
| 8748205 | MEMS structure with adaptable inter-substrate bond | Kai-Chih Liang, Jiou-Kang Lee, Chung-Hsien Lin, Chia-Hua Chu | 2014-06-10 |
| 8729646 | MEMS devices and methods for forming the same | Chia-Hua Chu, Chun-Wen Cheng, Chung-Hsien Lin | 2014-05-20 |
| 8623768 | Methods for forming MEMS devices | Yuan-Chih Hsieh | 2014-01-07 |