Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11184694 | Integrated microphone device and manufacturing method thereof | Chun-Wen Cheng, Chia-Hua Chu, Chun-Yin Tsai, Wen Cheng Kuo | 2021-11-23 |
| 11097941 | Method of fabricating semiconductor structure | Yi-Hsien Chang, Chun-Ren Cheng, Shih-Wei Lin, Jung-Kuo Tu | 2021-08-24 |
| 10609463 | Integrated microphone device and manufacturing method thereof | Chun-Wen Cheng, Wen Cheng Kuo, Chia-Hua Chu, Chun-Yin Tsai | 2020-03-31 |
| 10273140 | Substrate structure, semiconductor structure and method for fabricating the same | Yi-Hsien Chang, Chun-Ren Cheng, Shih-Wei Lin, Jung-Kuo Tu | 2019-04-30 |
| 10087071 | Semiconductor structure and manufacturing method thereof | Chia-Hua Chu, Yi Heng Tsai, Cheng San Chou, Chen-Hsiung Yang | 2018-10-02 |
| 10065852 | MEMS device and manufacturing method thereof | Chun-Wen Cheng, Chia-Hua Chu, MING-DAO WU | 2018-09-04 |
| 9975754 | Semiconductor structure and manufacturing method thereof | Fu-Chun Huang, Li-Chen Yen, Yi Heng Tsai, Chun-Ren Cheng | 2018-05-22 |
| 9656855 | Semiconductor structure and manufacturing method thereof | Fu-Chun Huang, Li-Chen Yen, Yi Heng Tsai, Chun-Ren Cheng | 2017-05-23 |
| 9493346 | Capacitor with planarized bonding for CMOS-MEMS integration | Wei-Cheng Shen, Yi-Hsien Chang, Yi Heng Tsai, Chun-Ren Cheng, Chun-Wen Cheng | 2016-11-15 |
| 9446945 | Isolation structure for MEMS 3D IC integration | Yi Heng Tsai, Yi-Hsien Chang, Chun-Ren Cheng, Chun-Wen Cheng, Wei-Cheng Shen | 2016-09-20 |
| 9449867 | VHF etch barrier for semiconductor integrated microsystem | Yi-Hsien Chang, Kai-Chih Liang, Yi Heng Tsai, Wei-Cheng Shen, Chun-Ren Cheng +2 more | 2016-09-20 |