Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8309441 | Process for eliminating delamination between amorphous silicon layers | Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen | 2012-11-13 |
| 8281658 | Method to produce 3-D optical gyroscope my MEMS technology | Ting-Hau Wu, Chun-Ren Cheng, Jung-Huei Peng, Shang-Ying Tsai | 2012-10-09 |
| 8237235 | Metal-ceramic multilayer structure | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2012-08-07 |
| 8237263 | Method and apparatus for cooling an integrated circuit | Ting-Hau Wu, Chun-Ren Cheng, Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai +1 more | 2012-08-07 |
| 8232614 | Package systems having a conductive element through a substrate thereof and manufacturing methods of the same | Chia-Hua Chu, Kuei-Sung Chang, Chung-Hsien Lin, Chia-Ming Hung, Jung-Huei Peng +1 more | 2012-07-31 |
| 8218286 | MEMS microphone with single polysilicon film | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2012-07-10 |
| 8106470 | Triple-axis MEMS accelerometer having a bottom capacitor | Ting-Hau Wu, Chun-Wen Cheng, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng +1 more | 2012-01-31 |
| 8053336 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jung-Huei Peng | 2011-11-08 |
| 8053377 | Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same | Shang-Ying Tsai, Chun-Ren Cheng, Jung-Huei Peng, Ting-Hau Wu | 2011-11-08 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures | Shang-Ying Tsai, Chun-Ren Cheng, Jung-Huei Peng, Ting-Hau Wu | 2011-08-16 |
| 7999257 | Process for eliminating delamination between amorphous silicon layers | Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen | 2011-08-16 |
| 7923379 | Multi-step process for forming high-aspect-ratio holes for MEMS devices | Ting-Hau Wu, Shang-Ying Tsai, Jung-Huei Peng, Chun-Ren Cheng | 2011-04-12 |