Issued Patents All Time
Showing 26–50 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2021-04-20 |
| 10870574 | Method and apparatus for reducing in-process and in-use stiction for MEMS devices | Lee-Chuan Tseng, Chang-Ming Wu, Shih-Chang Liu | 2020-12-22 |
| 10865103 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2020-12-15 |
| 10787360 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2020-09-29 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2020-05-26 |
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2019-11-05 |
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Ping-Yin Liu | 2019-08-20 |
| 10273143 | Method and apparatus for reducing in-process and in-use stiction for MEMS devices | Lee-Chuan Tseng, Chang-Ming Wu, Shih-Chang Liu | 2019-04-30 |
| 10273142 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2019-04-30 |
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Chun-Wen Cheng | 2018-12-25 |
| 10138118 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Chia-Shiung Tsai, Ru-Liang Lee | 2018-11-27 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2018-11-06 |
| 10053361 | Method of selectively removing an anti-stiction layer on a eutectic bonding area | Hung-Hua Lin, Wen-Chuan Tai, Hsiang-Fu Chen | 2018-08-21 |
| 9975757 | Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices | Lee-Chuan Tseng, Chung-Yen Chou, Shih-Chang Liu | 2018-05-22 |
| 9878899 | Method and apparatus for reducing in-process and in-use stiction for MEMS devices | Lee-Chuan Tseng, Chang-Ming Wu, Shih-Chang Liu | 2018-01-30 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Chun-Wen Cheng | 2018-01-23 |
| 9828234 | Semiconductor MEMS structure and manufacturing method thereof | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2017-11-28 |
| 9796584 | Method for fabricating a micro-well of a biosensor | Che-Ming Chang, Chih-Jen Chan, Chung-Yen Chou, Lee-Chuan Tseng, Shih-Wei Lin | 2017-10-24 |
| 9776858 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2017-10-03 |
| 9776852 | Method for controlling surface roughness in MEMS structure | Lee-Chuan Tseng, Hung-Hua Lin | 2017-10-03 |
| 9738516 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Chia-Shiung Tsai, Ru-Liang Lee | 2017-08-22 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Ping-Yin Liu | 2017-08-08 |
| 9714914 | CMOS compatible biofet | Lee-Chuan Tseng, Che-Ming Chang, Chung-Yen Chou | 2017-07-25 |
| 9708179 | Method of improving getter efficiency by increasing superficial area | Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan, Lan-Lin Chao | 2017-07-18 |
| 9637378 | Cup-like getter scheme | Chih-Jen Chan, Lee-Chuan Tseng, Shih-Wei Lin, Che-Ming Chang, Chung-Yen Chou | 2017-05-02 |