Issued Patents All Time
Showing 76–92 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8648468 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2014-02-11 |
| 8633086 | Power devices having reduced on-resistance and methods of their manufacture | Alex Kalnitsky, Hsiao-Chin Tuan, Liang Han, Uway Tseng, Hung-Hua Lin | 2014-01-21 |
| 8623768 | Methods for forming MEMS devices | Te-Hao Lee | 2014-01-07 |
| 8598687 | Semiconductor having a high aspect ratio via | Richard Chu, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-12-03 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu +2 more | 2013-11-12 |
| 8486744 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Chun-Wen Cheng | 2013-07-16 |
| 8445380 | Semiconductor having a high aspect ratio via | Richard Chu, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-05-21 |
| 8405169 | Handling layer for transparent substrate | Chun-Ren Cheng, Yi-Hsien Chang, Allen Timothy Chang, Ching-Ray Chen, Li-Cheng Chu +2 more | 2013-03-26 |
| 8357561 | Method of fabricating backside illuminated image sensor | Shih-Chi Fu, Gwo-Yuh Shiau, Liang-Lung Yao, Feng-Jia Shiu | 2013-01-22 |
| 8207595 | Semiconductor having a high aspect ratio via | Richard Chu, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2012-06-26 |
| 7923344 | Method of fabricating backside illuminated image sensor | Shih-Chi Fu, Gwo-Yuh Shiau, Liang-Lung Yao, Feng-Jia Shiu | 2011-04-12 |
| 7883926 | Methods for fabricating image sensor devices | Gwo-Yuh Shiau, Ming Chyi Liu, Shih-Chi Fu, Chia-Shiung Tsai | 2011-02-08 |
| 7883917 | Semiconductor device with bonding pad | Ming Chyi Liu, Yuan-Hung Liu, Gwo-Yuh Shiau, Chi-Hsin Lo, Chia-Shiung Tsai | 2011-02-08 |
| 7799654 | Reduced refractive index and extinction coefficient layer for enhanced photosensitivity | Chung-Yi Yu, Tsung-Hsun Huang, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2010-09-21 |
| 7732299 | Process for wafer bonding | Fa-Yuan Chang, Tsung-Mu Lai, Kai-Chih Liang, Hua-Shu Wu, Chin-Hsiang Ho +6 more | 2010-06-08 |
| 7709872 | Methods for fabricating image sensor devices | Gwo-Yuh Shiau, Ming Chyi Liu, Shih-Chi Fu, Chia-Shiung Tsai | 2010-05-04 |
| 7648851 | Method of fabricating backside illuminated image sensor | Shih-Chu Fu, Gwo-Yuh Shiau, Liang-Lung Yao, Feng-Jia Shiu | 2010-01-19 |