Issued Patents All Time
Showing 51–75 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Jung-Huei Peng +3 more | 2017-04-04 |
| 9606081 | Method for fabricating a micro-well of a biosensor | Che-Ming Chang, Chih-Jen Chan, Chung-Yen Chou, Lee-Chuan Tseng, Shih-Wei Lin | 2017-03-28 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Jung-Huei Peng, Lan-Lin Chao +2 more | 2017-01-03 |
| 9527188 | Grinding wheel for wafer edge trimming | Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-12-27 |
| 9472504 | Semiconductor having a high aspect ratio via | Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-10-18 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Lan-Lin Chao +2 more | 2016-09-20 |
| 9434076 | Robot blade design | Lee-Chuan Tseng, Chih-Jen Chan, Shih-Wei Lin, Che-Ming Chang, Chung-Yen Chou | 2016-09-06 |
| 9377401 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-06-28 |
| 9355882 | Transfer module for bowed wafers | Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-05-31 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2016-05-10 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng +3 more | 2016-03-22 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan, Lan-Lin Chao | 2016-01-26 |
| 9224615 | Noble gas bombardment to reduce scallops in bosch etching | Che-Ming Chang, Lee-Chuan Tseng, Shih-Wei Lin, Chih-Jen Chan, Ming Chyi Liu +1 more | 2015-12-29 |
| 9099476 | Semiconductor having a high aspect ratio via | Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2015-08-04 |
| 9054121 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Jung-Huei Peng, Lan-Lin Chao +2 more | 2015-06-09 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu +2 more | 2015-05-19 |
| 8969979 | MEMS devices | Te-Hao Lee | 2015-03-03 |
| 8945344 | Systems and methods of separating bonded wafers | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2015-02-03 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Jung-Huei Peng +3 more | 2014-12-09 |
| 8846129 | Biological sensing structures and methods of forming the same | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai | 2014-09-30 |
| 8790946 | Methods of bonding caps for MEMS devices | Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Lan-Lin Chao, Chun-Wen Cheng +1 more | 2014-07-29 |
| 8790954 | Method of making wafer structure for backside illuminated color image sensor | Tzu-Hsuan Hsu, Dun-Nian Yaung, Chung-Yi Yu | 2014-07-29 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu +2 more | 2014-05-27 |
| 8710560 | Embedded bonding pad for image sensors | Shih-Chang Liu, Shih-Chi Fu, Tzu-Hsuan Hsu, Chung-Yi Yu, Gwo-Yuh Shiau +1 more | 2014-04-29 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Jung-Huei Peng +3 more | 2014-02-11 |