Issued Patents All Time
Showing 76–99 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8841201 | Systems and methods for post-bonding wafer edge seal | Yi-Chuan Teng, Shang-Ying Tsai, Hsin-Ting Huang, Lin-Min Hung, Yao-Te Huang +1 more | 2014-09-23 |
| 8776600 | Gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2014-07-15 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu, Ping-Yin Liu +2 more | 2014-05-27 |
| 8728845 | Method and apparatus for selectively removing anti-stiction coating | Shih-Wei Lin, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2014-05-20 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Yi-Chuan Teng +1 more | 2014-04-01 |
| 8674495 | Package systems having a eutectic bonding material and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai | 2014-03-18 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Yuan-Chih Hsieh +3 more | 2014-02-11 |
| 8609466 | Cap and substrate electrical connection at wafer level | — | 2013-12-17 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Hsin-Ting Huang, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2013-11-12 |
| 8563400 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2013-10-22 |
| 8455999 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2013-06-04 |
| 8377798 | Method and structure for wafer to wafer bonding in semiconductor packaging | Hsin-Ting Huang, Yao-Te Huang, Shang-Ying Tsai, Ping-Yin Liu | 2013-02-19 |
| 8367516 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2013-02-05 |
| 8362578 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee | 2013-01-29 |
| 8281658 | Method to produce 3-D optical gyroscope my MEMS technology | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2012-10-09 |
| 8237235 | Metal-ceramic multilayer structure | Ting-Hau Wu, Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee | 2012-08-07 |
| 8237263 | Method and apparatus for cooling an integrated circuit | Ting-Hau Wu, Chun-Ren Cheng, Chun-Wen Cheng, Jiou-Kang Lee, Shang-Ying Tsai +1 more | 2012-08-07 |
| 8232614 | Package systems having a conductive element through a substrate thereof and manufacturing methods of the same | Chia-Hua Chu, Kuei-Sung Chang, Chung-Hsien Lin, Chia-Ming Hung, Yi Heng Tsai +1 more | 2012-07-31 |
| 8218286 | MEMS microphone with single polysilicon film | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2012-07-10 |
| 8106470 | Triple-axis MEMS accelerometer having a bottom capacitor | Ting-Hau Wu, Chun-Wen Cheng, Chun-Ren Cheng, Shang-Ying Tsai, Jiou-Kang Lee +1 more | 2012-01-31 |
| 8053377 | Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same | Shang-Ying Tsai, Chun-Ren Cheng, Jiou-Kang Lee, Ting-Hau Wu | 2011-11-08 |
| 8053336 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2011-11-08 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures | Shang-Ying Tsai, Chun-Ren Cheng, Jiou-Kang Lee, Ting-Hau Wu | 2011-08-16 |
| 7923379 | Multi-step process for forming high-aspect-ratio holes for MEMS devices | Jiou-Kang Lee, Ting-Hau Wu, Shang-Ying Tsai, Chun-Ren Cheng | 2011-04-12 |