Issued Patents All Time
Showing 26–50 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10273144 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang | 2019-04-30 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Chun-Wen Cheng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang, Li-Min Hung +1 more | 2019-04-30 |
| 10273142 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2019-04-30 |
| 10266390 | Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring | Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Hung-Hua Lin, Yao-Te Huang | 2019-04-23 |
| 10266396 | MEMS device with enhanced sensing structure and manufacturing method thereof | Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen, Chun-Wen Cheng | 2019-04-23 |
| 10202278 | Semiconductor structure with cavity spacing monitoring functions | Yi-Chien Wu, Yu-Chia Liu, Chun-Wen Cheng | 2019-02-12 |
| 10160639 | Semiconductor structure for MEMS Device | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng | 2018-12-25 |
| 10155244 | Fluid deposition appartus and method | Chun-Wen Cheng, Yi-Shao Liu, Fei-Lung Lai, Shang-Ying Tsai | 2018-12-18 |
| 10046965 | CMOS-MEMS structure and method of forming the same | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2018-08-14 |
| 9998843 | Method for manufacturing a microphone | Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2018-06-12 |
| 9950522 | MEMS devices and methods of fabrication thereof | Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu | 2018-04-24 |
| 9938134 | Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device | Shiang-Chi Lin, Yu-Chia Liu, Yi-Chien Wu, Wei Tan | 2018-04-10 |
| 9919914 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2018-03-20 |
| 9834436 | Cap and substrate electrical connection at wafer level | — | 2017-12-05 |
| 9834435 | Structure and formation method of semiconductor device structure | Ping-Yin Liu, Xin-Hua Huang, Yeong-Jyh Lin | 2017-12-05 |
| 9828234 | Semiconductor MEMS structure and manufacturing method thereof | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2017-11-28 |
| 9822000 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Chia-Hua Chu | 2017-11-21 |
| 9695039 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang | 2017-07-04 |
| 9677884 | Methods of forming a gyroscope sensor and a structure for a gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2017-06-13 |
| 9673169 | Method and apparatus for a wafer seal ring | Yi-Chuan Teng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung, Yao-Te Huang +1 more | 2017-06-06 |
| 9656260 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2017-05-23 |
| 9643838 | Semiconductor device and package and manufacturing method thereof | Chia-Hua Chu, Yi-Chien Wu, Li-Min Hung | 2017-05-09 |
| 9630831 | Semiconductor sensing structure | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2017-04-25 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2017-04-11 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2017-04-04 |