Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134555 | Method and structure for CMOS-MEMS thin film encapsulation | Chia-Hua Chu, Chun-Wen Cheng | 2024-11-05 |
| 12074547 | Driving circuit and method, frequency converter, device and computer readable storage medium | Yingyi Jiang, Peiyu Dang, Yongying Guo, Songru Huang | 2024-08-27 |
| 11924805 | Positioning method and device, electronic device and storage medium | Yanze Jiang | 2024-03-05 |
| 11667517 | Method and structure for CMOS-MEMS thin film encapsulation | Chia-Hua Chu, Chun-Wen Cheng | 2023-06-06 |
| 11312623 | Semiconductor structure for MEMS device | Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng | 2022-04-26 |
| 10752497 | Semiconductor structure for MEMS device | Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng | 2020-08-25 |
| 10689247 | Method and structure for CMOS-MEMS thin film encapsulation | Chia-Hua Chu, Chun-Wen Cheng | 2020-06-23 |
| 10494252 | MEMS devices and methods of manufacturing the same | Chia-Hua Chu, Chun-Wen Cheng | 2019-12-03 |
| 10358339 | Micro-electro-mechanical device having low thermal expansion difference | Ming-Han Tsai, Wei-Leun Fang | 2019-07-23 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Chun-Wen Cheng, Jung-Huei Peng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang +1 more | 2019-04-30 |
| 10273144 | Multi-pressure MEMS package | Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng | 2019-04-30 |
| 10202278 | Semiconductor structure with cavity spacing monitoring functions | Jung-Huei Peng, Yi-Chien Wu, Chun-Wen Cheng | 2019-02-12 |
| 10160639 | Semiconductor structure for MEMS Device | Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng | 2018-12-25 |
| 9944513 | Micro-electro-mechanical device having low thermal expansion difference | Ming-Han Tsai, Wei-Leun Fang | 2018-04-17 |
| 9938134 | Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device | Shiang-Chi Lin, Jung-Huei Peng, Yi-Chien Wu, Wei Tan | 2018-04-10 |
| 9868628 | Method and structure for CMOS-MEMS thin film encapsulation | Chia-Hua Chu, Chun-Wen Cheng | 2018-01-16 |
| 9695039 | Multi-pressure MEMS package | Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng | 2017-07-04 |
| 9464986 | Multiplex fiber optic biosensor and detection method by using the same | Lai-Kwan Chau, Chen-Han Huang, Hisng-Ying Lin | 2016-10-11 |
| D766310 | Full touch flush-mount room unit controller with graphical user interface | Cai Wei Jiang, An Luo | 2016-09-13 |
| 9403673 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2016-08-02 |
| 9233839 | MEMS device and method of forming the same | Chia-Hua Chu, Jung-Huei Peng, Kuei-Sung Chang, Chun-Wen Cheng | 2016-01-12 |
| 9221674 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2015-12-29 |
| D738229 | Full touch flush-mount room unit controller | Cai Wei Jiang, An Luo | 2015-09-08 |
| D730358 | Connecting port stand | — | 2015-05-26 |
| 9035451 | Wafer level sealing methods with different vacuum levels for MEMS sensors | Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng | 2015-05-19 |