Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363947 | Structure and formation method of semiconductor device with contact structures | Shih-Chieh Wu, Pang-Chi Wu, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +2 more | 2025-07-15 |
| 12211787 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2025-01-28 |
| 12199034 | Via rail structure | Hao Kuang, Tung-Heng Hsieh, Sheng-Hsiung Wang, Bao-Ru Young, Pang-Chi Wu | 2025-01-14 |
| 12125743 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Kuo-Yi Chao | 2024-10-22 |
| 11915971 | Contact formation method and related structure | Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang | 2024-02-27 |
| 11670544 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Kuo-Yi Chao | 2023-06-06 |
| 11640936 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2023-05-02 |
| 11322394 | Contact formation method and related structure | Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang | 2022-05-03 |
| 11189525 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Kuo-Yi Chao | 2021-11-30 |
| 11127684 | Low-resistance interconnect structures | Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Ru-Gun Liu | 2021-09-21 |
| 10636697 | Contact formation method and related structure | Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang | 2020-04-28 |