Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156423 | Composite film and manufacturing method thereof, and encapsulation structure including the composite film | — | 2024-11-26 |
| 12137516 | Package with self shielding | Hongya Xu, Valter Pasku, Martin Handtmann, Lueder Elbrecht | 2024-11-05 |
| D1047157 | Warm belt | — | 2024-10-15 |
| 12113032 | Substrate having undercut portion for stress mitigation | YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more | 2024-10-08 |
| D1041022 | Neck massager | — | 2024-09-03 |
| 11724115 | System and method for reducing heat of an implantable medical device during wireless charging | Luis Ortiz Hernandez, Nicholas Sachs | 2023-08-15 |
| 11723143 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Chang Kyu Choi, Hyun Mo Ku, Sarah Haney | 2023-08-08 |
| D983984 | Warm belt | — | 2023-04-18 |
| 11276650 | Stress mitigation structure | YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more | 2022-03-15 |
| 10827617 | Printed circuit board with cavity | Dingyou Zhang, Nitesh Kumbhat, Sarah Haney, Chang Kyu Choi | 2020-11-03 |
| 10364504 | Fabrication of multilayered nanosized porous membranes and their use for making novel nanostructures | — | 2019-07-30 |
| 10134682 | Circuit package with segmented external shield to provide internal shielding between electronic components | Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani | 2018-11-20 |
| 9997428 | Via structures for thermal dissipation | Marshall Maple, Ashish Alawani, Sarah Haney | 2018-06-12 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Aaron Lee, Deog Soon Choi, Hyun Mo Ku, Jack Ajoian | 2018-02-27 |
| 9865479 | Method of attaching components to printed cirucuit board with reduced accumulated tolerances | Wei-Shun Wang, Ashish Alawani, Lea-Teng Lee | 2018-01-09 |