Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723143 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Chang Kyu Choi, Sarah Haney, Li Sun | 2023-08-08 |
| 9972590 | Semiconductor package having a solder-on-pad structure | Deog Soon Choi, Ah Ron Lee | 2018-05-15 |
| 9972592 | Bumped land grid array | Ah Ron Lee, Deog Soon Choi | 2018-05-15 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Deog Soon Choi, Lea-Teng Lee, Nitesh Kumbhat, Ah Ron Lee | 2018-05-15 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Li Sun, Aaron Lee, Deog Soon Choi, Jack Ajoian | 2018-02-27 |
| 9693445 | Printed circuit board with thermal via | Jin Jeong, Deog Soon Choi, Chris Y. Chung | 2017-06-27 |