Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002741 | Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths | Michael Leary, Chris Y. Chung, YongIk Choi, Domingo Figueredo | 2024-06-04 |
| 11610738 | Low profile passive components and devices and packages including the same | Michael Leary, Chris Y. Chung | 2023-03-21 |
| 10477673 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Chang-Yul Cheon, Sang Hwa Jung, Sung-Phyo Lim | 2019-11-12 |
| 10468356 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2019-11-05 |
| 10285258 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Chang-Yul Cheon, Sang Hwa Jung, Sung-Phyo Lim | 2019-05-07 |
| 10264666 | Method of providing compartment EMI shields on printed circuit board using a vacuum | Deog Soon Choi | 2019-04-16 |
| 10229888 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2019-03-12 |
| 10178757 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2019-01-08 |
| 10134686 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2018-11-20 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Deog Soon Choi, Hyun Mo Ku, Lea-Teng Lee, Nitesh Kumbhat | 2018-05-15 |
| 9972592 | Bumped land grid array | Deog Soon Choi, Hyun Mo Ku | 2018-05-15 |
| 9972590 | Semiconductor package having a solder-on-pad structure | Deog Soon Choi, Hyun Mo Ku | 2018-05-15 |
| 9565774 | Embedded trace substrate and method of forming the same | — | 2017-02-07 |