Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7178233 | Process for producing a collapsed filled via hole | Toshiyuki Nakamura, Hideto Tanaka, Motonobu TAKAHASHI, Masahito Ishii, Daisuke Arai | 2007-02-20 |
| 6905757 | DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE | Toshifumi Matsushima, Hideaki Miwa, Kazuhiro Yamazaki, Tetsuro Sato, Fujio Kuwako | 2005-06-14 |
| 6798048 | 2-Metal layer TAB tape and both-sided CSP•BGA tape | Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii | 2004-09-28 |