Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7523548 | Method for producing a printed circuit board | Yoshikazu Akashi, Yutaka Iguchi | 2009-04-28 |
| 7495177 | Printed wiring board, its manufacturing method, and circuit device | Yoshikazu Akashi, Yutaka Iguchi | 2009-02-24 |
| 7060364 | Film carrier tape for mounting electronic devices thereon | Yoshikazu Akashi | 2006-06-13 |
| 6955178 | Substrate treatment apparatus | Masaki Kuzumoto, Seiji Noda, Izumi Oya, Makoto Miyamoto, Hideo Horibe +1 more | 2005-10-18 |
| 6798048 | 2-Metal layer TAB tape and both-sided CSP•BGA tape | Akira Ichiryu, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii | 2004-09-28 |
| 6715944 | Apparatus for removing photoresist film | Izumi Oya, Seiji Noda, Makoto Miyamoto, Masaki Kuzumoto, Masashi Ohmori | 2004-04-06 |
| 6616773 | Substrate treatment method | Masaki Kuzumoto, Seiji Noda, Izumi Oya, Makoto Miyamoto, Hideo Horibe +1 more | 2003-09-09 |
| 6517999 | Method of removing photoresist film | Izumi Oya, Seiji Noda, Makoto Miyamoto, Masaki Kuzumoto, Masashi Ohmori | 2003-02-11 |
| 6129100 | Wafer cleaning apparatus and structure for holding and transferring wafer used in wafer cleaning apparatus | Kenichi Kitagawa, Kiyoshi Shimada, Ei'ichi Ando, Takashi Yoneda, Yoshihito Tatehaba | 2000-10-10 |
| 5919538 | Method of manufacturing TAB tapes and laminated body for producing the same | Junji Tokushima, Hiroshi Iguchi | 1999-07-06 |
| 5866020 | Method of manufacturing TAB tapes and laminated body for producing the same | Junji Tokushima, Hiroshi Iguchi | 1999-02-02 |
| 5173369 | Tape carrier having connection function | — | 1992-12-22 |
| 5118386 | Printed circuit board having bumps and method of forming bumps | Yutaka Iguchi | 1992-06-02 |
| 5019944 | Mounting substrate and its production method, and printed wiring board having connector function and its connection method | Masahito Ishii, Yoshitaka Tanaka | 1991-05-28 |