Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262469 | Copper-clad laminate plate and printed wiring board | Daisuke Nakajima | 2025-03-25 |
| 12104265 | Roughened copper foil, copper-clad laminate and printed wiring board | Ayumu Tateoka, Tsubasa Kato, Po-Chun Yang | 2024-10-01 |
| 10244635 | Production method for copper-clad laminate plate | Ayumu Tateoka, Makoto Hosokawa | 2019-03-26 |