MM

Mitsuyoshi Matsuda

MC Mitsui Mining & Smelting Co.: 9 patents #45 of 838Top 6%
Brother Kogyo: 1 patents #2,155 of 2,767Top 80%
Pioneer Electronic: 1 patents #1,093 of 1,840Top 60%
Overall (All Time): #398,337 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12344953 Electrolytic copper foil Daisuke Nakajima, Yasuji Hara, Mitsuhiro Wada 2025-07-01
12168838 Electrolytic copper foil Daisuke Nakajima, Yasuji Hara, Mitsuhiro Wada 2024-12-17
9663868 Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil Kazuhiro Yoshikawa, Takao Fujimoto 2017-05-30
9338898 Method of producing a printed wiring board Joji Fujii, Hiroaki Tsuyoshi, Hiroto IIDA, Kazuhiro Yoshikawa 2016-05-10
9307639 Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil Hisao Sakai, Masaru Takahashi, Makoto Dobashi 2016-04-05
9077827 Page-turning reader device and feeder device Norichika Hirohashi, Naoki Komuro, Yutaka Sasaki 2015-07-07
8722199 Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil Hisao Sakai, Sakiko Tomonaga, Makoto Dobashi 2014-05-13
8715836 Surface-treated electro-deposited copper foil and method for manufacturing the same Makoto Dobashi, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka +2 more 2014-05-06
8457506 Image-forming device Koji Abe, Takashi Shimizu, Haruyo Endo, Yoshiki Mori, Jun Hatta +1 more 2013-06-04
8419920 Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Hisao Sakai 2013-04-16
6969557 Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same Takashi Kataoka 2005-11-29
4821331 Coaxial speaker unit Fumio Murayama 1989-04-11