Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9307639 | Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil | Hisao Sakai, Masaru Takahashi, Mitsuyoshi Matsuda | 2016-04-05 |
| 8722199 | Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil | Mitsuyoshi Matsuda, Hisao Sakai, Sakiko Tomonaga | 2014-05-13 |
| 8715836 | Surface-treated electro-deposited copper foil and method for manufacturing the same | Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka +2 more | 2014-05-06 |
| 8419920 | Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film | Sakiko Tomonaga, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai | 2013-04-16 |
| 7811709 | Negative electrode for nonaqueous secondary battery, process of producing the negative electrode, and nonaqueous secondary battery | Shinichi Musha, Hitohiko Honda, Yoshiki Sakaguschi, Kiyotaka Yasuda, Akihiro Modeki +3 more | 2010-10-12 |
| 7524552 | Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer | Toshiko Yokota, Tetsuhiro Matsunaga, Susumu Takahashi, Hideaki Matsushima, Takuya Yamamoto | 2009-04-28 |
| 7455931 | Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cell | Kiyotaka Yasuda, Yoshiki Sakaguchi, Kazuko Taniguchi | 2008-11-25 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method | Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata | 2007-05-15 |
| 6984453 | Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil | Akiko Sugimoto, Junshi Yoshioka | 2006-01-10 |
| 6835297 | High current density electrolytic decomposition process for copper | Toshiko Yokota, Susumu Takahashi, Yoshiaki Kinoshita | 2004-12-28 |
| 6777108 | Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil | Shin-ichi Obata | 2004-08-17 |
| 6652725 | Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus | Kazuko Taniguchi, Hisao Sakai, Yasuji Hara | 2003-11-25 |
| 6649274 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil | Sakiko Taenaka, Akiko Sugimoto, Naotomi Takahashi | 2003-11-18 |
| 6610418 | Electolytic copper foil with carrier foil and method for manufacturing the same | Junshi Yoshioka, Akiko Sugimoto, Ken Iwakiri, Yutaka Hirasawa | 2003-08-26 |
| 6544664 | Copper foil for printed wiring board | Naotomi Takahashi, Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe +1 more | 2003-04-08 |
| 6541126 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil | Junshi Yoshioka, Akiko Sugimoto, Sakiko Taenaka, Tsutomu Higuchi, Takuya Yamamoto +1 more | 2003-04-01 |
| 6335099 | Corrosion resistant, magnesium-based product exhibiting luster of base metal and method for producing the same | Tsutomu Higuchi, Mitsuo Suzuki | 2002-01-01 |
| 6322904 | Copper foil for printed circuit boards | Hiroaki Kurihara, Toshiko Yokota, Hiroshi Hata, Naotomi Takahashi, Tatsuya Sudo | 2001-11-27 |
| 6194056 | High tensile strength electrodeposited copper foil | Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki +1 more | 2001-02-27 |
| 6183880 | Composite foil of aluminum and copper | Junshi Yoshioka, Shinichi Obata, Takashi Kataoka | 2001-02-06 |
| 6071629 | Organic rust-proof treated copper foil | Toshiko Yokota, Hiroshi Hata, Hisao Sakai, Susumu Takahashi, Junshi Yoshioka | 2000-06-06 |
| 5958209 | High tensile strength electrodeposited copper foil and process of electrodepositing thereof | Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki +1 more | 1999-09-28 |