Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12171067 | Method of manufacturing printed wiring board | Yoshinori Shimizu, Hiroto IIDA, Misato Mizoguchi, Makoto Hosokawa | 2024-12-17 |
| 12004304 | Method for manufacturing printed wiring board | Yoshinori Shimizu, Hiroto IIDA, Misato Mizoguchi, Makoto Hosokawa | 2024-06-04 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method | Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Makoto Dobashi | 2007-05-15 |