Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344953 | Electrolytic copper foil | Daisuke Nakajima, Mitsuyoshi Matsuda, Mitsuhiro Wada | 2025-07-01 |
| 12168838 | Electrolytic copper foil | Daisuke Nakajima, Mitsuyoshi Matsuda, Mitsuhiro Wada | 2024-12-17 |
| 6984456 | Flexible printed wiring board for chip-on flexibles | Kazuyuki Okada, Akira Uchiyama, Masaru Takahashi | 2006-01-10 |
| 6652725 | Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus | Kazuko Taniguchi, Makoto Dobashi, Hisao Sakai | 2003-11-25 |
| 6444112 | Manufacturing method of electrodeposited copper foil | Nobuyuki Imada, Yutaka Hirasawa, Naoya Matsushita | 2002-09-03 |
| 6194056 | High tensile strength electrodeposited copper foil | Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki +1 more | 2001-02-27 |
| 5958209 | High tensile strength electrodeposited copper foil and process of electrodepositing thereof | Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki +1 more | 1999-09-28 |