YH

Yutaka Hirasawa

MC Mitsui Mining & Smelting Co.: 17 patents #11 of 838Top 2%
MS Moriyama Sangyo: 7 patents #7 of 24Top 30%
KT Kabushiki Kaisha Toshiba: 5 patents #5,683 of 21,451Top 30%
JU Juki: 3 patents #35 of 281Top 15%
NK Nippon Kayaku: 1 patents #556 of 1,103Top 55%
Overall (All Time): #108,076 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 1–25 of 33 patents

Patent #TitleCo-InventorsDate
9873965 Loop material sewing method and loop sewing machine Liang Dong Lin 2018-01-23
D550869 LED lamp Kiyotoshi Hoshikawa, Kanji Tajima 2007-09-11
D550379 LED lamp Kiyotoshi Hoshikawa, Kanji Tajima 2007-09-04
D546985 LED lamp Kiyotoshi Hoshikawa, Kanji Tajima 2007-07-17
D520657 LED lamp Kiyotoshi Hoshikawa, Kanji Tajima 2006-05-09
D508234 LED holder Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima 2005-08-09
6902824 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same Takuya Yamamoto, Takashi Kataoka, Naotomi Takahashi 2005-06-07
D505663 LED holder Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima 2005-05-31
D505662 LED holder Hideo Moriyama, Kiyotoshi Hoshikawa, Kanji Tajima 2005-05-31
6827867 Method for manufacturing printed wiring board Takuya Yamamoto, Takashi Kataoka 2004-12-07
6716572 Manufacturing process for printed wiring board Takuya Yamamoto, Takashi Kataoka, Naotomi Takahashi 2004-04-06
6616827 Filtration method of copper electrolyte Kazuyoshi Nabekura, Naotomi Takahashi 2003-09-09
6610418 Electolytic copper foil with carrier foil and method for manufacturing the same Junshi Yoshioka, Akiko Sugimoto, Makoto Dobashi, Ken Iwakiri 2003-08-26
6605369 Surface-treated copper foil and method for producing the same Naotomi Takahashi 2003-08-12
6548153 Composite material used in making printed wiring boards Takashi Kataoka, Takuya Yamamoto, Kenichiro Iwakiri, Tsutomu Higuchi 2003-04-15
6479170 Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil Naotomi Takahashi 2002-11-12
6444112 Manufacturing method of electrodeposited copper foil Nobuyuki Imada, Yasuji Hara, Naoya Matsushita 2002-09-03
6319620 Making and using an ultra-thin copper foil Takashi Kataoka, Takuya Yamamoto, Kenichiro Iwakiri 2001-11-20
6270889 Making and using an ultra-thin copper foil Takashi Kataoka, Takuya Yamamoto, Kenichiro Iwakiri, Akiko Sugioka, Junshi Yoshioka 2001-08-07
6223667 Belt-loop sewing machine Yasushi Ono, Tomio Nii 2001-05-01
5997710 Copper foil for a printed circuit board, a process and an apparatus for producing the same Muneharu Ohara, Tomohiro Miyazaki 1999-12-07
5897761 Electrodeposited copper foil for printed wiring board and method for manufacturing the same Hideyasu Tagusari, Kazuhide Oshima 1999-04-27
5858517 Electrodeposited copper foil for printed wiring board and method of manufacturing the same Hideyasu Tagusari, Kazuhide Oshima 1999-01-12
5833819 Copper foil for a printed circuit board, a process and an apparatus for producing the same Muneharu Ohara, Tomohiro Miyazaki 1998-11-10
5640917 Welt forming device, and fabric guide Tomio Nii 1997-06-24