Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5997710 | Copper foil for a printed circuit board, a process and an apparatus for producing the same | Yutaka Hirasawa, Tomohiro Miyazaki | 1999-12-07 |
| 5959256 | Multilayer printed wiring board | Muneo Saida, Teturoh Satoh | 1999-09-28 |
| 5833819 | Copper foil for a printed circuit board, a process and an apparatus for producing the same | Yutaka Hirasawa, Tomohiro Miyazaki | 1998-11-10 |
| 5718039 | Method of making multilayer printed wiring board | Muneo Saida, Teturoh Satoh | 1998-02-17 |
| 5674611 | Adhesive for copper foils and an adhesive-applied copper foil | Muneo Saida, Teturoh Satoh | 1997-10-07 |
| 5482784 | Printed circuit inner-layer copper foil and process for producing the same | Masakazu Mitsuhashi | 1996-01-09 |