Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5959256 | Multilayer printed wiring board | Muneo Saida, Muneharu Ohara | 1999-09-28 |
| 5718039 | Method of making multilayer printed wiring board | Muneo Saida, Muneharu Ohara | 1998-02-17 |
| 5674611 | Adhesive for copper foils and an adhesive-applied copper foil | Muneo Saida, Muneharu Ohara | 1997-10-07 |