Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5959256 | Multilayer printed wiring board | Muneharu Ohara, Teturoh Satoh | 1999-09-28 |
| 5718039 | Method of making multilayer printed wiring board | Muneharu Ohara, Teturoh Satoh | 1998-02-17 |
| 5674611 | Adhesive for copper foils and an adhesive-applied copper foil | Muneharu Ohara, Teturoh Satoh | 1997-10-07 |
| 5545466 | Copper-clad laminate and printed wiring board | Yutaka Hirasawa, Katsuhiro Yoshimura | 1996-08-13 |
| 5437914 | Copper-clad laminate and printed wiring board | Yutaka Hirasawa, Katsuhiro Yoshimura | 1995-08-01 |