Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12269056 | Application device and application method | Hisaki Hayashi, Yasuyuki Watanabe, Yoshiyuki Andoh, Yasuo Nishioka, Shigeki Fukaya | 2025-04-08 |
| 8827769 | Method of producing substrate for magnetic recording media | Yasuyuki Nakanishi, Hidenori Inada | 2014-09-09 |
| 5545466 | Copper-clad laminate and printed wiring board | Muneo Saida, Yutaka Hirasawa | 1996-08-13 |
| 5437914 | Copper-clad laminate and printed wiring board | Muneo Saida, Yutaka Hirasawa | 1995-08-01 |
| 5096546 | Process for treating surface of copper foil | Nobuo Kitamura, Makoto Fujiki, Yukio Kodama | 1992-03-17 |