Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5897761 | Electrodeposited copper foil for printed wiring board and method for manufacturing the same | Yutaka Hirasawa, Kazuhide Oshima | 1999-04-27 |
| 5858517 | Electrodeposited copper foil for printed wiring board and method of manufacturing the same | Yutaka Hirasawa, Kazuhide Oshima | 1999-01-12 |