Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902824 | Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same | Takuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa | 2005-06-07 |
| 6839219 | Laminate for forming capacitor layer and method for manufacturing the same | Yasuaki Mashiko, Hideshi Sekimori | 2005-01-04 |
| 6716572 | Manufacturing process for printed wiring board | Takuya Yamamoto, Takashi Kataoka, Yutaka Hirasawa | 2004-04-06 |
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit | Takuya Yamamoto, Takashi Kataoka | 2003-12-09 |
| 6649274 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil | Sakiko Taenaka, Makoto Dobashi, Akiko Sugimoto | 2003-11-18 |
| 6616827 | Filtration method of copper electrolyte | Kazuyoshi Nabekura, Yutaka Hirasawa | 2003-09-09 |
| 6605369 | Surface-treated copper foil and method for producing the same | Yutaka Hirasawa | 2003-08-12 |
| 6585877 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-07-01 |
| 6579437 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-06-17 |
| 6544664 | Copper foil for printed wiring board | Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe, Masaru Takahashi +1 more | 2003-04-08 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-03-18 |
| 6531045 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-03-11 |
| 6478247 | Method for winding copper foil on core tube | Kazuhisa Fujiwara | 2002-11-12 |
| 6479170 | Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil | Yutaka Hirasawa | 2002-11-12 |
| 6322904 | Copper foil for printed circuit boards | Makoto Dobashi, Hiroaki Kurihara, Toshiko Yokota, Hiroshi Hata, Tatsuya Sudo | 2001-11-27 |
| 4640747 | Process for surface treatment of copper product | Kuniki Ueno | 1987-02-03 |