Issued Patents All Time
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428751 | Crystalline film of octacalcium phosphate and method for producing the same | Motohiro TAGAYA, Yanni Zhou, Zizhen Liu, Isamu Arakawa | 2025-09-30 |
| 12302504 | Production method for multilayer wiring board | Takenori Yanai, Toshimi Nakamura | 2025-05-13 |
| 12247280 | Metal foil with carrier | Yukiko KITABATAKE, Masahiro Koide, Rintaro Ishii | 2025-03-11 |
| 12193153 | Multilayer body | Rintaro Ishii, Toshimi Nakamura | 2025-01-07 |
| 12058819 | Multilayer body | Rintaro Ishii, Takenori Yanai | 2024-08-06 |
| 11961771 | Laminate sheet and method of use thereof | Takenori Yanai, Rintaro Ishii | 2024-04-16 |
| 11765840 | Copper foil with carrier | Rintaro Ishii, Takenori Yanai | 2023-09-19 |
| 11756845 | Copper foil with glass carrier and production method therefor | Takenori Yanai, Toshimi Nakamura | 2023-09-12 |
| 11637358 | Carrier-containing metal foil and method for manufacturing millimeter-wave antenna substrate using same | Mikiko KOMIYA, Takenori Yanai, Rintaro Ishii | 2023-04-25 |
| 11576267 | Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board | — | 2023-02-07 |
| 11527415 | Multilayer circuit board manufacturing method | Tetsuro Sato, Takenori Yanai, Toshimi Nakamura | 2022-12-13 |
| 11525073 | Multilayer circuit board manufacturing method | Tetsuro Sato, Toshimi Nakamura, Takenori Yanai | 2022-12-13 |
| 11317522 | Wiring board manufacturing method | Toshimi Nakamura | 2022-04-26 |
| 11071214 | Method for manufacturing multilayer wiring board | Yasuhiro Seto, Toshimi Nakamura | 2021-07-20 |
| 10888003 | Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board | — | 2021-01-05 |
| 10886146 | Copper foil with carrier, production method for same, production method for coreless support with wiring layer, and production method for printed circuit board | — | 2021-01-05 |
| 10840180 | Production method for multilayer wiring board | Takenori Yanai, Toshimi Nakamura | 2020-11-17 |
| 10772219 | Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board | — | 2020-09-08 |
| 10763002 | Surface-treated copper foil, manufacturing method therefor, printed circuit board copper-clad laminate, and printed circuit board | — | 2020-09-01 |
| 10645809 | Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board | Joe Nishikawa, Hiroaki Kurihara | 2020-05-05 |
| 10492308 | Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board | — | 2019-11-26 |
| 10356915 | Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board | — | 2019-07-16 |
| 10283728 | Electrolytic copper foil and manufacturing method therefor | Toshimi Nakamura, Masaharu Myoi, Hajime Watanabe | 2019-05-07 |
| 9985238 | Electrolytic copper foil and electronic device | — | 2018-05-29 |
| 9786404 | Metal foil and electronic device | Nozomu Kitajima, Toshimi Nakamura, Masaharu Myoi | 2017-10-10 |