TS

Tetsuro Sato

MC Mitsui Mining & Smelting Co.: 21 patents #7 of 838Top 1%
NS Nippon Sharyo: 4 patents #17 of 87Top 20%
PA Panasonic: 3 patents #7,617 of 21,108Top 40%
SO Sony: 3 patents #10,744 of 25,231Top 45%
HI Hitachi: 2 patents #13,388 of 28,497Top 50%
SU Subaru: 2 patents #413 of 1,436Top 30%
NK Nihon Musen Kabushiki Kaisha: 1 patents #7 of 25Top 30%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
AC Asmo Co.: 1 patents #369 of 745Top 50%
NE Nec: 1 patents #7,889 of 14,502Top 55%
📍 Toyokawa, JP: #11 of 656 inventorsTop 2%
Overall (All Time): #84,921 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
7163600 Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer Noriyuki Nagashima 2007-01-16
7144472 Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method Noriyuki Nagashima 2006-12-05
6905757 DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE Toshifumi Matsushima, Hideaki Miwa, Akira Ichiryu, Kazuhiro Yamazaki, Fujio Kuwako 2005-06-14
6831129 Resin-coated copper foil, and printed wiring board using resin-coated copper foil Tsutomu Asai, Toshifumi Matsushima 2004-12-14
6739834 Flexbeam Tomomi Mochida, Tsutomu Nagayoshi 2004-05-25
6716530 RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM Tsutomu Asai 2004-04-06
6652962 Resin-coated composite foil, production and use thereof Tsutomu Asai, Kenichiro Iwakiri 2003-11-25
6541789 High temperature superconductor Josephson junction element and manufacturing method for the same Jian Wen, Naoki Koshizuka, Shoji Tanaka 2003-04-01
5800722 Multilayer printed wiring board and process for manufacturing the same Hiroaki Tsuyoshi 1998-09-01
5218708 Videotext communication network with a receiving terminal that automatically preforms operations to network responsive to predetermined schedule Yoshiyuki Kanbayashi, Tadahiko Nakao, Yasuo Koiwai, Shigeyuki Shimauchi, Yasuo Misawa +5 more 1993-06-08
5053665 Retaining structure of brush spring of electric motor Mineo Yamaguchi 1991-10-01
4893988 System for damping lead-lag motion of rotor blades of helicopter 1990-01-16
4384993 Method of the production of immunoglobulin having high content of monomer Akinobu Funatsu, Komei Ohashi, Shoji Ono, Tsunemasa Yoshida 1983-05-24