Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10723916 | Organic film CMP slurry composition and polishing method using same | Jung Min Choi, Yong Soon Park, Yong-Sik Yoo, Dong-Hun Kang, Go-Un Kim +1 more | 2020-07-28 |
| 9676966 | Chemical mechanical polishing composition and process | Akitoshi Yoshida, Hirofumi Kashihara, Pascal Berar | 2017-06-13 |
| 8540894 | Polishing composition | Takayuki Matsushita, Masashi Teramoto | 2013-09-24 |
| 7968465 | Periodic acid compositions for polishing ruthenium/low K substrates | Robert Small, Kenichi Orui, Steve Masami Aragaki, Atsushi Hayashida | 2011-06-28 |
| 7316976 | Polishing method to reduce dishing of tungsten on a dielectric | Yoshibumi Suzuki | 2008-01-08 |
| 6827752 | Cerium oxide slurry, and method of manufacturing substrate | Akitoshi Yoshida, Pascal Berar | 2004-12-07 |
| 6443811 | Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing | Sumit Pandey, Jeremy Stephens, Ravikumar Ramachandran | 2002-09-03 |
| 6419557 | Polishing method and polisher used in the method | Rempei Nakata, Masako Kodera, Nobuo Hayasaka | 2002-07-16 |
| 6303506 | Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process | Ronald J. Schutz, Ravikumar Ramachandran | 2001-10-16 |
| 6224464 | Polishing method and polisher used in the method | Rempei Nakata, Masako Kodera, Nobuo Hayasaka | 2001-05-01 |
| 6059920 | Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method | Rempei Nakata, Kiyotaka Kawashima | 2000-05-09 |