Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7202168 | Method of producing semiconductor device | Hiroshi Ikenoue, Masaaki Hatano, Soichi Yamashita, Takashi Yoda, Makoto Sekine | 2007-04-10 |
| 7091733 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2006-08-15 |
| 6998342 | Electronic device manufacturing method | Tetsuo Matsuda, Hiroshi Toyoda | 2006-02-14 |
| 6992864 | Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature | Hiroyuki Iwahara, Yukihiro Komura, Mitsuhiro Izumi, Shinji Fujimoto | 2006-01-31 |
| 6946387 | Semiconductor device and method for manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2005-09-20 |
| 6913681 | Plating method and plating apparatus | Tetsuo Matsuda, Katsuya Okumura | 2005-07-05 |
| 6897143 | Method of manufacturing semiconductor device including two-step polishing operation for cap metal | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Dai Fukushima, Tetsuo Matsuda | 2005-05-24 |
| 6774024 | Semiconductor integrated circuit device having multilevel interconnection | Koji Miyamoto, Kenji Yoshida | 2004-08-10 |
| 6767437 | Electroplating apparatus and electroplating method | Tetsuo Matsuda, Koji Mishima, Natsuki Makino, Junji Kunisawa | 2004-07-27 |
| 6764585 | Electronic device manufacturing method | Tetsuo Matsuda, Hiroshi Toyoda | 2004-07-20 |
| 6746589 | Plating method and plating apparatus | Koji Mishima, Hiroaki Inoue, Natsuki Makino, Junji Kunisawa, Kenji Nakamura +2 more | 2004-06-08 |
| 6727593 | Semiconductor device with improved bonding | Hiroshi Toyoda, Mitsuhiro Nakao, Masahiko Hasunuma, Atsuko Sakata, Toshiaki Komukai | 2004-04-27 |
| 6678112 | Disk drive device | — | 2004-01-13 |
| 6673704 | Semiconductor device and method of manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2004-01-06 |
| 6670714 | Semiconductor integrated circuit device having multilevel interconnection | Koji Miyamoto, Kenji Yoshida | 2003-12-30 |
| 6638411 | Method and apparatus for plating substrate with copper | Koji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Tetsuo Matsuda | 2003-10-28 |
| 6632335 | Plating apparatus | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2003-10-14 |
| 6633450 | Method of and apparatus for controlling disk drive | — | 2003-10-14 |
| 6632476 | Substrate processing method and substrate processing apparatus | Hiroko Nakamura, Tetsuo Matsuda | 2003-10-14 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Dai Fukushima, Tetsuo Matsuda | 2003-08-26 |
| 6579785 | Method of making multi-level wiring in a semiconductor device | Hiroshi Toyoda, Tetsuo Matsuda, Hideaki Hirabayashi | 2003-06-17 |
| 6563308 | Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium | Osamu Nagano, Yuichiro Yamazaki, Motosuke Miyoshi, Tetsuo Matsuda | 2003-05-13 |
| 6555925 | Semiconductor device and producing method thereof | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tamao Takase, Hideki Shibata | 2003-04-29 |
| 6552434 | Semiconductor device and manufacturing method thereof | Masahiko Hasunuma, Shohei Shima, Sachiyo Ito | 2003-04-22 |
| 6518177 | Method of manufacturing a semiconductor device | Takashi Kawanoue, Junichi Wada, Tetsuo Matsuda | 2003-02-11 |