Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417925 | Method of conductive material deposition | Kai-Hung Yu, Nicholas Joy, Yusuke Yoshida, Kandabara Tapily | 2025-09-16 |
| 11380579 | Method and process using dual memorization layer for multi-color spacer patterning | Kaoru Maekawa, Akiteru Ko | 2022-07-05 |
| 11315789 | Method and structure for low density silicon oxide for fusion bonding and debonding | Kiyotaka Imai, Hiroshi Maeda, Kaoru Maekawa, Yuji Mimura, Harunobu Suenaga | 2022-04-26 |
| 10777456 | Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process | Kaoru Maekawa | 2020-09-15 |
| 10734278 | Method of protecting low-K layers | Karthikeyan Pillai, Nicholas Joy, Kandabara Tapily | 2020-08-04 |
| 7190011 | Semiconductor device and method for manufacturing same | Hiroyasu Minda | 2007-03-13 |
| 6998712 | Semiconductor device and method for manufacturing the same | Norio Okada, Hiroyasu Minda | 2006-02-14 |