Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854453 | Method for reducing reactive ion etch lag in low K dielectric etching | Angelique Raley, Christopher Cole | 2020-12-01 |
| 10438797 | Method of quasi atomic layer etching | Hongyun Cottle | 2019-10-08 |
| 10332744 | Method for patterning a substrate using a layer with multiple materials | Anton J. deVilliers | 2019-06-25 |
| 9818610 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Yannick Feurprier, Katie Lutker-Lee | 2017-11-14 |
| 9607834 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Yannick Feurprier, Katie Lutker-Lee | 2017-03-28 |
| 9396958 | Self-aligned patterning using directed self-assembly of block copolymers | Anton J. deVilliers | 2016-07-19 |
| 9368368 | Method for increasing oxide etch selectivity | — | 2016-06-14 |
| 9257529 | Method of forming self-aligned contacts using a replacement metal gate process in a semiconductor device | — | 2016-02-09 |
| 8808562 | Dry metal etching method | Yusuke Ohsawa, Hiroto Ohtake, Eiji Suzuki, Kaushik A. Kumar | 2014-08-19 |
| 8501630 | Selective etch process for silicon nitride | Hongyun Cottle | 2013-08-06 |
| 8382997 | Method for high aspect ratio patterning in a spin-on layer | — | 2013-02-26 |
| 8138364 | Transparent conducting oxide thin films and related devices | Tobin J. Marks, Jun Ni, Anchuan Wang, Yu-Chi Yang, Shu Jin +1 more | 2012-03-20 |