| 11948721 |
Packaged isolation barrier with integrated magnetics |
Ying-Chuan Kao, Hung-Yu Chou, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake |
2024-04-02 |
| 11908705 |
Interconnect singulation |
— |
2024-02-20 |
| 11817374 |
Electronic device with exposed tie bar |
Bo-Hsun Pan, Yuh-Harng Chien |
2023-11-14 |
| 11444012 |
Packaged electronic device with split die pad in robust package substrate |
Yuh-Harng Chien, Chang-Yen Ko |
2022-09-13 |
| 11342247 |
Leadframe with vertically spaced die attach pads |
Chia-Yu Chang, Steven Su |
2022-05-24 |
| 11081428 |
Electronic device with three dimensional thermal pad |
Stanley Shihyao Chou, Yuh-Harng Chien, Steven Kummerl, Bo-Hsun Pan, Pi-Chiang Huang +1 more |
2021-08-03 |
| 10811343 |
Method of making a wire support leadframe for a semiconductor device |
Yuh-Harng Chien, Steven Su |
2020-10-20 |
| 10600724 |
Leadframe with vertically spaced die attach pads |
Chia-Yu Chang, Steven Su |
2020-03-24 |
| 10573581 |
Leadframe |
Chung-Hao Lin, Yuh-Harng Chien |
2020-02-25 |
| 10529654 |
Wire support for a leadframe |
Yuh-Harng Chien, Steven Su |
2020-01-07 |
| 10395971 |
Dam laminate isolation substrate |
Chang-Yen Ko, Chung Ming Cheng, Megan Chang |
2019-08-27 |
| 10229868 |
Method of making a wire support leadframe for a semiconductor device |
Yuh-Harng Chien, Steven Su |
2019-03-12 |
| 10211132 |
Packaged semiconductor device having multi-level leadframes configured as modules |
Chia-Yu Chang, Steven Su |
2019-02-19 |
| 10121733 |
Wire support for a leadframe |
Yuh-Harng Chien, Steven Su |
2018-11-06 |
| 9922908 |
Semiconductor package having a leadframe with multi-level assembly pads |
Chia-Yu Chang, Steven Su |
2018-03-20 |
| 9627331 |
Method of making a wire support leadframe for a semiconductor device |
Yuh-Harng Chien, Steven Su |
2017-04-18 |
| 8546184 |
Package substrate having die pad with outer raised portion and interior recessed portion |
Saihsi Jen, Eric Hsieh |
2013-10-01 |
| 8455989 |
Package substrate having die pad with outer raised portion and interior recessed portion |
Saihsi Jen, Eric Hsieh |
2013-06-04 |
| 7387484 |
Wafer positioning systems and methods thereof |
Jenn-Shiang Shieh |
2008-06-17 |
