Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546184 | Package substrate having die pad with outer raised portion and interior recessed portion | Chih-Chien Ho, Eric Hsieh | 2013-10-01 |
| 8455989 | Package substrate having die pad with outer raised portion and interior recessed portion | Chih-Chien Ho, Eric Hsieh | 2013-06-04 |