Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Chien-Chang Li, Hung-Yu Chou, Sheng-Wen Huang, Byron Lovell Williams | 2024-04-30 |
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Byron Lovell Williams +2 more | 2023-12-19 |