Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5979728 | Apparatus for breaking and separating dies from a wafer | — | 1999-11-09 |
| 5710065 | Method and apparatus for breaking and separating dies from a wafer | — | 1998-01-20 |
| 5650915 | Thermally enhanced molded cavity package having a parallel lid | Katherine G. Heinen, Paul J. Hundt | 1997-07-22 |
| 5527744 | Wafer method for breaking a semiconductor | Michael A. Mignardi | 1996-06-18 |
| 5458716 | Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid | Katherine G. Heinen, Paul J. Hundt | 1995-10-17 |
| 5455195 | Method for obtaining metallurgical stability in integrated circuit conductive bonds | Thomas H. Ramsey | 1995-10-03 |
| 5435876 | Grid array masking tape process | David Blair | 1995-07-25 |
| 5393706 | Integrated partial sawing process | Michael A. Mignardi | 1995-02-28 |
| 5244140 | Ultrasonic bonding process beyond 125 kHz | Thomas H. Ramsey | 1993-09-14 |
| 5201453 | Linear, direct-drive microelectronic bonding apparatus and method | Gonzalo Amador, Robert A. Davis | 1993-04-13 |
| 5201454 | Process for enhanced intermetallic growth in IC interconnections | Lau B. Howe, Thomas H. Ramsey | 1993-04-13 |
| 5186378 | Method and apparatus for transducer heating in low temperature bonding | — | 1993-02-16 |
| 4974767 | Double cone wire bonding capillary | James R. Peterson | 1990-12-04 |