Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7244664 | Method for dicing and singulating substrates | Leon Stiborek | 2007-07-17 |
| 6413150 | Dual dicing saw blade assembly and process for separating devices arrayed a substrate | — | 2002-07-02 |
| 5435876 | Grid array masking tape process | Rafael C. Alfaro | 1995-07-25 |