Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334413 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Mihir K. Roy | 2025-06-17 |
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Mihir K. Roy | 2024-03-26 |
| 10872837 | Air-cavity semiconductor package with low cost high thermal carrier | Robert Charles Dry | 2020-12-22 |
| 7956706 | Multiband filter having comb-line and ceramic resonators with different pass-bands propagating in different modes | Mostafa Mohamed Taher AbuShaaban | 2011-06-07 |